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Physical Dimensions
2X
0.10 C
2.0
A
B
1.45
2.0
(0.25)
PIN1
IDENT
0.10 C
0.08 C
0.05
0.00
TOP VIEW
A
0.55 MAX
2X
(0.15)
C
0.10 C
0.80 1.80
6X 0.50
0.65
6X 0.35
RECOMMENDED LAND PATTERN
SEATING
PLANE
SIDE VIEW
NOTES:
1.35
1.45
A. PACKAGE CONFORMS TO JEDEC MO-229
EXCEPT WHERE NOTED.
PIN1
IDENT
1
3
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
0.70
ASME Y14.5M, 1994.
6X 0.35
0.25
0.80
D. LANDPATTERN RECOMMENDATION IS BASED
ON FSC DESIGN ONLY.
6X 0.25
0.10 C A B
0.05 C
0.35
6
4
0.65
E. DRAWING FILENAME: MKT-UMLP06Erev2.
BOTTOM VIEW
Figure 16. 6-Lead Molded Leadless Package (UMLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers
Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2009 Fairchild Semiconductor Corporation
FAN5341 ? Rev. 1.0.1
10
www.fairchildsemi.com
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